For miniaturized electronic components, DETECH equipment achieve high consistency production with micron-level dispensing precision, which is adapted to high-speed assembly lines to ensure the stability and quality of electronic products.
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DETECH provides excellent bonding, sealing and protection through its advanced adhesive application solutions, ensuring efficient and stable operation of devices in demanding environments.
Two-component Dynamic Mixing Silicone Foam Platform Series (ACE Foam 120Sil Series).