Electronically

For miniaturized electronic components, DETECH equipment achieve high consistency production with micron-level dispensing precision, which is adapted to high-speed assembly lines to ensure the stability and quality of electronic products.

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Technical Challenges

Applications

DETECH provides excellent bonding, sealing and protection through its advanced adhesive application solutions, ensuring efficient and stable operation of devices in demanding environments.

Advantages

Micronized Adhesive Coating Technology Supports the Miniaturization of Communications Equipment and Complex Structures
High-precision Gluing Equipment can be Integrated with Automated Production Lines to Enhance Production Efficiency
Shortest Time to Determine the Location of the Fault, Reducing Maintenance Time
Parameters Uploaded in Real Time, Strong Product Traceability

A Case of Germany Automobile Brand ECU Housing Flame Retardant Silicone Sealing Dynamic Hybrid Foam

Two-component Dynamic Mixing Silicone Foam Platform Series (ACE Foam 120Sil Series).

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