Semiconductors_Industrial Applications_Suzhou Detech Automation Technology Co.,Ltd

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Feeding Series Metering Series Dispensing Series Dedicated Machine Transferring System Accessories

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Sealing&Bonding Spraying Potting Lubrication Foaming
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Semiconductors

We serve chip packaging and wafer-level process with nano-scale ultra-precision dispensing technology, avoiding damage to sensitive components and realizing micron glue line precision.

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Location：Home > Industrial Applications > Semiconductors

Technical Challenges

Sub-micron Precision Control

The thickness of the adhesive should be controlled within ±1μm.
High Cleanliness Requirements

The production environment requires a high level of dust protection, up to 100 levels or even higher.
Specialty Glue Adaptation and Technique Synergy

3.Materials such as conductive adhesives and bottom filler adhesives have widely varying viscosity/curing characteristics and need to be synergized with processes such as SMD and reflow soldering.
Balance of High Productivity and Equipment Stability

Problems of glue splash and nozzle clogging occur frequently in high-speed dispensing.

Applications

DETECH improves the development of advanced semiconductor technology by enhancing the reliability and heat dissipation of semiconductor packages through adhesive, sealing, thermal conductivity and insulation functions.

Encapsulation & Protection Application

Thermal Management Application

Microelectronic Package Sealing Application

Wafer Level Package (WLP) Coating Application

Advantages

High-precision Micro-coating: Supports High-End Packaging Technique and Meets Advanced Manufacturing Needs

Reliability Breakthrough: Reduced Risk of Package Delamination/warping, and Increased 30% in Product Life

High Stability Continuous Mass Production: Guaranteed by Self-Cleaning System

Semiconductors

Technical Challenges

Applications

Advantages

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